Waffle Tray With A Regular Arrangement Of Cavities Is Used To Load The Chips
Hiner-pack has leading mould processing and injection molding equipment,high level dustless cleaning devices and a variety of testing equipment.Meanwhile,Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as researching institutions.Hiner-pack has mastered special process technique and manufacturing in semiconductor packaging raw material field.Owned a lot of inventions and practical new patents.Through years of unremitting efforts,Hiner-pack has a professional R&D team to improve semiconductor packaging products,constantly launch new products,and solve the customers’ demand for high quality products.
Character Reference
1. Material:ESD ABS injection molding
2. Properties:release goods surface of goods static charge,so the goods will not produce charge accumulation and high potential difference.
3. Strong, moisture-proof and preservative
4. Use:cycle loading ,packaging storage and transportation in producing processing and electronic devices
Benefits
Able to present non-standard components to Pick and Place machines
Multiple uses for fixture including component bake-out, storage and shipping
Cost effective alternative to “tape and reel” or “hand” placement
1. Small size, light weight, low transportation cost
2. Each tray can accommodate a large number of chips suitable for transfer or loading samples for testing
3. Stable anti-static performance, good protection chip is not hurt by resistance
4. Very good flatness, easy to operate on automatic equipment
5. It can be matched with the cover and clips of the same series, convenient to meet all kinds of shipping methods
6. Recycling, plastic material is easy to degrade after waste, no environmental concerns
7. It can be stack-able and can also ensure the design of maximum utilization of tray matrix
Detail Information
| Outline Size |
Material |
Surface Resistance |
Service |
Flatness |
Color |
| 2" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.2mm |
Customizable |
| 3" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.25mm |
Customizable |
| 4" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.3mm |
Customizable |
| Custom size |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
TBC |
Customizable |
| Provide professional design and packaging for your products |
| Outline Line Size |
50*50*4mm |
Brand |
Hiner-pack |
| Model |
HN 80*80-15 |
Package Type |
IC Parts |
| Cavity Size |
3.02*2.03*0.381mm |
Matrix QTY |
16*16=250PCS |
| Material |
ABS |
Flatness |
MAX 0.2mm |
| Color |
Black |
Service |
Accept OEM,ODM |
| Resistance |
1.0x10e4-1.0x10e11Ω |
Certificate |
ROHS |
Application
IC, Electronic component, Semiconductor, Micro and Nano systems and Sensor IC etc
FAQ
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.
Product Tags:
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Load Chips 250PCS Waffle Pack Chip Trays With Regular Arrangement Cavities Images
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