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ROHS Black ESD Jedec Tray High Temperature Resistant For LGA IC Chips

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ROHS Black ESD Jedec Tray High Temperature Resistant For LGA IC Chips

Brand Name : Hiner-pack

Model Number : HN21061

Certification : ISO 9001 ROHS SGS

Place of Origin : Made In China

MOQ : 1000 pcs

Price : $1.35~$2.38(Prices are determined according to different incoterms and quantities)

Payment Terms : T/T

Supply Ability : The capacity is between 2500PCS~3000PCS/per day

Delivery Time : 5~7 working days

Packaging Details : 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm

Material : PPE

Color : Black

Temperature : 150°C

Property : ESD

Surface resistance : 1.0x10E4~1.0x10E11Ω

Flatness : less than 0.76mm

OEM&ODM : Accept

Mold Type : Injection

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ROHS Black ESD Jedec Tray High Temperature Resistant For LGA IC Chips

High temperature resistant and antistatic IC Jedec tray

Detail Description:

Outline Line Size

322.6*135.9*8.5mm

Brand

Hiner-pack

Model

HN 21061

IC Package Type

LGA

Cavity Size

20.2*20.2*3.35mm

Matrix QTY

5*12=60PCS

Material

PPE

Flatness

MAX 0.76mm

Color

Black

Service

Accept OEM,ODM

Resistance

1.0x10e4-1.0x10e11Ω

Certificate

ROHS

All Jedc matrix trays are 12.7*5.35inch(322.6*135.9mm) and are suitable for a variety of chip packages, including BGA.CSP.QFP.QFN... And so on.

Location of Filler Pockets for Vacuum Chuck

The filler pockets for vacuum chuck shall be formed as follows:

(1) One at the center of the tray and one on each end, as located in Tables 2 and 3.

(2) The center filler pocket shall be 32 x 32 mm at least.

Jedec tray is compatible with jedec tray feeder, reducing manual handling and loading and other processes, providing a complete automation service for efficient production, realizing automatic picking during assembly, avoiding damage to chips and avoiding manual picking and chip oxidation.

Product Application

Electronic component Semiconductor Embedded System Display technology

Micro and Nano systems Sensor Test and Measurement Techology
Electromechanical equipment and systems Power supply

Reference to temperature resistance of different materials

Material

Bake Temperature

Surface Resistance

PPE

Bake 125°C~Max 150°C

1.0*10E4Ω~1.0*10E11Ω

MPPO+Carbon Fiber

Bake 125°C~Max 150°C

1.0*10E4Ω~1.0*10E11Ω

MPPO+Carbon Powder

Bake 125°C~Max 150°C

1.0*10E4Ω~1.0*10E11Ω

MPPO+Glass Fiber

Bake 125°C~Max 150°C

1.0*10E4Ω~1.0*10E11Ω

PEI+Carbon Fiber

Max 180°C

1.0*10E4Ω~1.0*10E11Ω

IDP Color

85°C

1.0*10E6Ω~1.0*10E10Ω

Color, temperature and other special requirements can be customized

ROHS Black ESD Jedec Tray High Temperature Resistant For LGA IC Chips

Advantage

1. Flexible OEM service: we can produce products according to customer’s sample or design.

2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.

3. Complicated workmanship: tooling making, Injection molding,Production

4. Comprehensive customer service: from customer consultation to after sales service.

5. 10 years experience of OEM for USA and EU customers.

6. We have our own factory and can control quality in high level and produce products quickly and flexibly.

ROHS Black ESD Jedec Tray High Temperature Resistant For LGA IC Chips

Anti-static tray is an ideal tool for storing electronic components. It is made of special polymer chains added in the raw materials, so it has permanent electrostatic dissipation performance.Anti-static tray has good mechanical strength and heat resistance, good impact strength, strong chemical corrosion resistance, and will not change its anti-static performance due to the environment, time and temperature.


Product Tags:

ESD Jedec Tray

      

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ROHS Jedec IC Trays

      
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