Sign In | Join Free | My portofva.com
China Shenzhen Hiner Technology Co.,LTD logo
Shenzhen Hiner Technology Co.,LTD
Verified Supplier

5 Years

Home > Bare Die Trays >

Bare Die Tray With Dimensions Of 101.6x101.6x4.50 For Semiconductor And IC

Shenzhen Hiner Technology Co.,LTD
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

Bare Die Tray With Dimensions Of 101.6x101.6x4.50 For Semiconductor And IC

Brand Name : Hiner-pack

Model Number : HN25031

Place Of Origin : Shenzhen, China

Certification : ISO 9001 ROHS SGS

MOQ : 1000 Pcs

Price : $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities)

Packaging Details : It Depends On The QTY Of Order And Size Of Product

Delivery Time : 5~8 Working Days

Payment Terms : T/T

Supply Ability : 4000PCS~5000PCS/per Day

Place of Origin : Shenzhen,China

Lid And Clip : Optional

Surface Resistance : 1.0x10E4~1.0x10E11Ω

Flatness : <0.3mm

Use : Transport,Storage,Packing

Stackable : Yes

Shape : Rectangular

Optional : Lid/Cover And Clip/Clamp

Injection Mold : Lead Time 20~25 Days

Contact Now

Product Description:


As a core supplier in the field of semiconductor packaging and testing, our company has independently developed the Bare die trays series, specifically designed to meet the high-precision semiconductor manufacturing requirements. Relying on the global trend of miniaturization and high integration in the semiconductor industry, we have gained deep insights into the stringent market requirements for chip carriers and have formed a complete product line covering full-size chips. This product is permanently antistatic, dustproof, and wear-resistant, with extremely high dimensional accuracy. It provides good protection for the products during repeated transportation and use, ensuring long-lasting and stable product performance.

Technical Parameters:

Customizable Yes
Custom Logo Available
Durability Sturdy And Impact-Resistant
Heat Resistant Yes
Flatness <0.3mm
Lid And Clip Optional
Shape Rectangular
Stackable Yes
Surface Resistance 1.0x10E4~1.0x10E11Ω
Use Transport, Storage, Packing

Applications:

I. Semiconductor Packaging

Bare die tray can be used to store and protect bare chips, ensuring they are not contaminated or damaged during transportation, handling, and packaging processes.

II. Chip Testing

During the chip testing phase, using a bare die tray can ensure the chip remains stable during the testing process, improving the accuracy and reliability of the tests.

III. Storage and Distribution

Using a bare die tray can ensure chips remain clean, organized, and secure during storage and distribution, reducing the risk of damage and loss.


Customization:

Product Customization Services for IC Die Carriers - Bare Die Tray

Brand Name: Hiner-pack

Model Number: HN25031

Place Of Origin: Shenzhen, China

Certification: ISO 9001 ROHS SGS

Payment Terms: T/T

Custom Logo: Available

Shape: Rectangular

Design: Standard And Non-standard

Surface Resistance: 1.0x10E4~1.0x10E11Ω


FAQ:

Q:Can this product specify a freight forwarder?

A:Absolutely, it's entirely up to you.

Q:Is there any discount for large orders?

A:Yes. The specific discount price will be negotiated based on the size of your order.


Product Tags:

Bare Die Tray 101.6x101.6x4.50

      

Semiconductor Bare Die Tray

      

IC Bare Die Tray with warranty

      
China Bare Die Tray With Dimensions Of 101.6x101.6x4.50 For Semiconductor And IC wholesale

Bare Die Tray With Dimensions Of 101.6x101.6x4.50 For Semiconductor And IC Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Shenzhen Hiner Technology Co.,LTD
*Subject:
*Message:
Characters Remaining: (0/3000)